Vertically integrated circuits at fermilab

Grzegorz Deptuch; Marcel Demarteau; James Hoff; Ronald Lipton; Alpana Shenai; Marcel Trimpl; Raymond Yarema; Tom Zimmerman

doi:10.1109/NSSMIC.2009.5402167

Vertically integrated circuits at fermilab

Grzegorz Deptuch, Marcel Demarteau, James Hoff, Ronald Lipton, Alpana Shenai, Marcel Trimpl, Raymond Yarema, Tom Zimmerman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.

Original language	English
Title of host publication	2009 IEEE Nuclear Science Symposium Conference Record, NSS/MIC 2009
Pages	1907-1915
Number of pages	9
DOIs	https://doi.org/10.1109/NSSMIC.2009.5402167
State	Published - 2009
Externally published	Yes
Event	2009 IEEE Nuclear Science Symposium Conference Record, NSS/MIC 2009 - Orlando, FL, United States Duration: Oct 25 2009 → Oct 31 2009

Publication series

Name	IEEE Nuclear Science Symposium Conference Record
ISSN (Print)	1095-7863

Conference

Conference	2009 IEEE Nuclear Science Symposium Conference Record, NSS/MIC 2009
Country/Territory	United States
City	Orlando, FL
Period	10/25/09 → 10/31/09

Access to Document

10.1109/NSSMIC.2009.5402167

Cite this

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title = "Vertically integrated circuits at fermilab",

abstract = "The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.",

author = "Grzegorz Deptuch and Marcel Demarteau and James Hoff and Ronald Lipton and Alpana Shenai and Marcel Trimpl and Raymond Yarema and Tom Zimmerman",

year = "2009",

doi = "10.1109/NSSMIC.2009.5402167",

language = "English",

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series = "IEEE Nuclear Science Symposium Conference Record",

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}

Deptuch, G, Demarteau, M, Hoff, J, Lipton, R, Shenai, A, Trimpl, M, Yarema, R & Zimmerman, T 2009, Vertically integrated circuits at fermilab. in 2009 IEEE Nuclear Science Symposium Conference Record, NSS/MIC 2009., 5402167, IEEE Nuclear Science Symposium Conference Record, pp. 1907-1915, 2009 IEEE Nuclear Science Symposium Conference Record, NSS/MIC 2009, Orlando, FL, United States, 10/25/09. https://doi.org/10.1109/NSSMIC.2009.5402167

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AU - Deptuch, Grzegorz

AU - Demarteau, Marcel

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AU - Lipton, Ronald

AU - Shenai, Alpana

AU - Trimpl, Marcel

AU - Yarema, Raymond

AU - Zimmerman, Tom

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AB - The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.

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Y2 - 25 October 2009 through 31 October 2009

ER -

Vertically integrated circuits at fermilab

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