Vertically integrated circuits at Fermilab

Grzegorz W. Deptuch; Marcel Demarteau; James R. Hoff; Ronald Lipton; Alpana Shenai; Marcel Trimpl; Raymond Yarema; Tom Zimmerman

doi:10.1109/TNS.2010.2049659

Vertically integrated circuits at Fermilab

Grzegorz W. Deptuch, Marcel Demarteau, James R. Hoff, Ronald Lipton, Alpana Shenai, Marcel Trimpl, Raymond Yarema, Tom Zimmerman

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38 Scopus citations

Abstract

The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.

Original language	English
Article number	5497177
Pages (from-to)	2178-2186
Number of pages	9
Journal	IEEE Transactions on Nuclear Science
Volume	57
Issue number	4 PART 2
DOIs	https://doi.org/10.1109/TNS.2010.2049659
State	Published - Aug 2010
Externally published	Yes

Funding

Manuscript received December 15, 2009; revised April 02, 2010; accepted April 19, 2010. Date of publication June 28, 2010; date of current version August 18, 2010. Fermi National Accelerator Laboratory is operated by Fermi Research Alliance, LLC under Contract DE-AC02-07CH11359 with the U.S. Department of Energy.

Funders	Funder number
Fermi Research Alliance, LLC	DE-AC02-07CH11359
U.S. Department of Energy
SLAC National Accelerator Laboratory

Keywords

3D-IC technology
CMOS
TSV
integrated circuits
pixel detector
radiation imaging detectors
readout electronics
vertically integrated pixel readout device
wafer bonding

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10.1109/TNS.2010.2049659

Cite this

@article{f5b033c328be412bbf11a797bc441d67,

title = "Vertically integrated circuits at Fermilab",

abstract = "The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.",

keywords = "3D-IC technology, CMOS, TSV, integrated circuits, pixel detector, radiation imaging detectors, readout electronics, vertically integrated pixel readout device, wafer bonding",

author = "Deptuch, {Grzegorz W.} and Marcel Demarteau and Hoff, {James R.} and Ronald Lipton and Alpana Shenai and Marcel Trimpl and Raymond Yarema and Tom Zimmerman",

year = "2010",

month = aug,

doi = "10.1109/TNS.2010.2049659",

language = "English",

volume = "57",

pages = "2178--2186",

journal = "IEEE Transactions on Nuclear Science",

issn = "0018-9499",

publisher = "Institute of Electrical and Electronics Engineers",

number = "4 PART 2",

}

TY - JOUR

T1 - Vertically integrated circuits at Fermilab

AU - Deptuch, Grzegorz W.

AU - Demarteau, Marcel

AU - Hoff, James R.

AU - Lipton, Ronald

AU - Shenai, Alpana

AU - Trimpl, Marcel

AU - Yarema, Raymond

AU - Zimmerman, Tom

PY - 2010/8

Y1 - 2010/8

N2 - The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.

AB - The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.

KW - 3D-IC technology

KW - CMOS

KW - TSV

KW - integrated circuits

KW - pixel detector

KW - radiation imaging detectors

KW - readout electronics

KW - vertically integrated pixel readout device

KW - wafer bonding

UR - http://www.scopus.com/inward/record.url?scp=77955847861&partnerID=8YFLogxK

U2 - 10.1109/TNS.2010.2049659

DO - 10.1109/TNS.2010.2049659

M3 - Article

AN - SCOPUS:77955847861

SN - 0018-9499

VL - 57

SP - 2178

EP - 2186

JO - IEEE Transactions on Nuclear Science

JF - IEEE Transactions on Nuclear Science

IS - 4 PART 2

M1 - 5497177

ER -

Vertically integrated circuits at Fermilab

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