Transport properties of bulk thermoelectrics - An international round-robin study, Part I: Seebeck coefficient and electrical resistivity

Hsin Wang, Wallace D. Porter, Harald Böttner, Jan König, Lidong Chen, Shengqiang Bai, Terry M. Tritt, Alex Mayolet, Jayantha Senawiratne, Charlene Smith, Fred Harris, Patricia Gilbert, Jeff W. Sharp, Jason Lo, Holger Kleinke, Laszlo Kiss

Research output: Contribution to journalArticlepeer-review

117 Scopus citations

Abstract

Recent research and development of high-temperature thermoelectric materials has demonstrated great potential for converting automobile exhaust heat directly into electricity. Thermoelectrics based on classic bismuth telluride have also started to impact the automotive industry by enhancing air-conditioning efficiency and integrated cabin climate control. In addition to engineering challenges of making reliable and efficient devices to withstand thermal and mechanical cycling, the remaining issues in thermoelectric power generation and refrigeration are mostly materials related. The dimensionless figure of merit, ZT, still needs to be improved from the current value of 1.0 to 1.5 to above 2.0 to be competitive with other alternative technologies. In the meantime, the thermoelectric community could greatly benefit from the development of international test standards, improved test methods, and better characterization tools. Internationally, thermoelectrics have been recognized by many countries as a key component for improving energy efficiency. The International Energy Agency (IEA) group under the Implementing Agreement for Advanced Materials for Transportation (AMT) identified thermoelectric materials as an important area in 2009. This paper is part I of the international round-robin testing of transport properties of bulk thermoelectrics. The main foci in part I are the measurement of two electronic transport properties: Seebeck coefficient and electrical resistivity.

Original languageEnglish
Pages (from-to)654-664
Number of pages11
JournalJournal of Electronic Materials
Volume42
Issue number4
DOIs
StatePublished - Apr 2013

Funding

The authors would like to thank the International Energy Agency under the Implementing Agreement for Advanced Materials for Transportation for supporting this work, the assistant secretary for Energy Efficiency and Renewable Energy of the Department of Energy and the Propulsion Materials Program under the Vehicle Technologies Program. We would like to thank all participating institutions and Oak Ridge National Laboratory managed by UT-Battelle LLC under contract DE-AC05000OR22725 for support.

FundersFunder number
U.S. Department of Energy
UT-BattelleDE-AC05000OR22725
International Energy Agency

    Keywords

    • Seebeck coefficient
    • Thermoelectric
    • electrical resistivity
    • round-robin

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