Toward interpreting failure in Sintered-Silver interconnection systems

The mechanical strength and subsequent reliability of a sintered-silver interconnection "system" is a function of numerous independent parameters, and that "system" is still undergoing process development. Most of those parameters (e.g., choice of plating) are arguably and unfortunately often taken for granted and are independent of the silver's cohesive strength. To explore such effects, shear strength testing and failure analyses were completed on a simple, mock sintered-silver interconnection system consisting of bonding two DBC ceramic substrates. Silver and gold platings were part of the test matrix, as were drying strategies, and the consideration of stencil-printing vs. screen-printing. Shear strength of sintered-silver interconnect systems was found to be insensitive to the choice of plating, drying practice, and printing method provided careful and consistent processing of the sintered-silver are practiced. Lastly, with the examined interconnection systems, it was observed that a maximum shear failure stress of ~ 60 MPa is achievable.