TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors

Tyler Leblond; Ryan S. Bennink; Justin G. Lietz; Christopher M. Seck

doi:10.1145/3624062.3624214

TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors

Tyler Leblond, Ryan S. Bennink, Justin G. Lietz, Christopher M. Seck

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

We introduce the Trapped-Ion Surface Code Compiler (TISCC), a software tool that generates circuits for a universal set of surface code patch operations in terms of a native trapped-ion gate set. To accomplish this, TISCC manages an internal representation of a trapped-ion system where a repeating pattern of trapping zones and junctions is arranged in an arbitrarily large rectangular grid. Surface code operations are compiled by instantiating surface code patches on the grid and using methods to generate transversal operations over data qubits, rounds of error correction over stabilizer plaquettes, and/or lattice surgery operations between neighboring patches. Beyond the implementation of a basic surface code instruction set, TISCC contains corner movement functionality and a patch translation that is implemented using ion movement alone. Except in the latter case, all TISCC functionality is extensible to alternative grid-like hardware architectures. TISCC output has been verified using the Oak Ridge Quasi-Clifford Simulator (ORQCS).

Original language	English
Title of host publication	Proceedings of 2023 SC Workshops of the International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023
Publisher	Association for Computing Machinery
Pages	1426-1435
Number of pages	10
ISBN (Electronic)	9798400707858
DOIs	https://doi.org/10.1145/3624062.3624214
State	Published - Nov 12 2023
Event	2023 International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023 - Denver, United States Duration: Nov 12 2023 → Nov 17 2023

Publication series

Name	ACM International Conference Proceeding Series

Conference

Conference	2023 International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023
Country/Territory	United States
City	Denver
Period	11/12/23 → 11/17/23

Funding

This work was completed as part of the Defense Advanced Research Projects Agency Quantum Benchmarking program. This manuscript has been authored by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (https://www.energy.gov/downloads/doe-public-access-plan).

Funders	Funder number
U.S. Department of Energy

Access to Document

10.1145/3624062.3624214

Cite this

Leblond, T., Bennink, R. S., Lietz, J. G., & Seck, C. M. (2023). TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors. In Proceedings of 2023 SC Workshops of the International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023 (pp. 1426-1435). (ACM International Conference Proceeding Series). Association for Computing Machinery. https://doi.org/10.1145/3624062.3624214

Leblond, Tyler ; Bennink, Ryan S. ; Lietz, Justin G. et al. / TISCC : A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors. Proceedings of 2023 SC Workshops of the International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023. Association for Computing Machinery, 2023. pp. 1426-1435 (ACM International Conference Proceeding Series).

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abstract = "We introduce the Trapped-Ion Surface Code Compiler (TISCC), a software tool that generates circuits for a universal set of surface code patch operations in terms of a native trapped-ion gate set. To accomplish this, TISCC manages an internal representation of a trapped-ion system where a repeating pattern of trapping zones and junctions is arranged in an arbitrarily large rectangular grid. Surface code operations are compiled by instantiating surface code patches on the grid and using methods to generate transversal operations over data qubits, rounds of error correction over stabilizer plaquettes, and/or lattice surgery operations between neighboring patches. Beyond the implementation of a basic surface code instruction set, TISCC contains corner movement functionality and a patch translation that is implemented using ion movement alone. Except in the latter case, all TISCC functionality is extensible to alternative grid-like hardware architectures. TISCC output has been verified using the Oak Ridge Quasi-Clifford Simulator (ORQCS).",

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Leblond, T , Bennink, RS, Lietz, JG & Seck, CM 2023, TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors. in Proceedings of 2023 SC Workshops of the International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023. ACM International Conference Proceeding Series, Association for Computing Machinery, pp. 1426-1435, 2023 International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023, Denver, United States, 11/12/23. https://doi.org/10.1145/3624062.3624214

TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors. / Leblond, Tyler ; Bennink, Ryan S.; Lietz, Justin G. et al.
Proceedings of 2023 SC Workshops of the International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023. Association for Computing Machinery, 2023. p. 1426-1435 (ACM International Conference Proceeding Series).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Leblond T , Bennink RS, Lietz JG, Seck CM. TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors. In Proceedings of 2023 SC Workshops of the International Conference on High Performance Computing, Network, Storage, and Analysis, SC Workshops 2023. Association for Computing Machinery. 2023. p. 1426-1435. (ACM International Conference Proceeding Series). doi: 10.1145/3624062.3624214

TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors

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