Thin-film adhesion measurement using laser-generated high-power surface acoustic wave

V. Kireev; Y. Liu; Y. Braiman; B. Radhakrishnan; C. H. Hsueh; P. F. Becher

doi:10.1063/1.2203205

Thin-film adhesion measurement using laser-generated high-power surface acoustic wave

V. Kireev, Y. Liu, Y. Braiman, B. Radhakrishnan, C. H. Hsueh, P. F. Becher

Multiscale Materials

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Abstract

A method of the interfacial adhesion measurements utilizing the generation and monitoring of high-power surface acoustic wave has been reported. High-power surface acoustic wave was generated by surface optical breakdown in a transparent dielectric substrate. Modification of the tension-to-shear stresses ratio with film thickness was demonstrated. The normal stress generated at the interface is about one order of magnitude higher compared to those reported in laser spallation experiments; therefore stronger interfaces can be tested with less damage to the substrate.

Original language	English
Article number	191911
Journal	Applied Physics Letters
Volume	88
Issue number	19
DOIs	https://doi.org/10.1063/1.2203205
State	Published - 2006

Funding

This research was sponsored by the Materials and Engineering Physics Program of the Division of Materials Sciences and Engineering, U. S. Department of Energy, under Contract No. DE-AC05-00OR22725 with UT-Battelle, LLC.

Funders	Funder number
U.S. Department of Energy	DE-AC05-00OR22725

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10.1063/1.2203205

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Thin-film adhesion measurement using laser-generated high-power surface acoustic wave

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