Thermoelectric transport and microstructural study of Cu doped Mg2Si0.4Sn0.6

Smita Howlader, Suniksha Gupta, R. Vasudevan, M. K. Banerjee, K. Sachdev

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations

Abstract

The Mg2X (X = Si and Sn) based alloys which are composed of abundant, non-toxic and inexpensive elements are promising mid-temperature thermoelectric (TE) materials. Herein, we report synthesis of Mg2Si0.4Sn0.6 by high energy ball milling followed by hot pressing for thermoelectric application. The use of Cu as a dopant, appears to provide p-type conductivity but experimentally, the system has been found to generate n-type conduction. The XRD investigations revealed successful attainment of a near to single phase alloy with only minute presence of elemental Si. Electrical conductivity of the order of 104 S/m and charge carrier concentration of the order of 1019 cm-3 have been obtained through ZEM and Hall coefficient measuring equipment respectively. LFA provides thermal conductivity in the range of 4.4 - 3.0 W/mK. In addition to the thermoelectric measurements, the elemental mapping of the hot-pressed sample has been carefully explored.

Original languageEnglish
Pages (from-to)100-103
Number of pages4
JournalMaterials Today: Proceedings
Volume30
DOIs
StatePublished - 2020
Externally publishedYes
Event2020 International Conference on Advancement inNanoelectronicsand Communication Technologies, ICANCT 2020 - Jaipur, India
Duration: Jan 17 2020Jan 18 2020

Funding

The study was supported by a grant from Global Innovation Technology Alliance - Department of Science and Technology [GITA/DST/TWN/P-68/2015], Government of India. We are thankful to Materials Research Centre, MNIT Jaipur for Ball milling, XRD, Sintering Hot Press, Hall measurement equipment and FESEM and National Taiwan University, Taiwan for ZEM and LFA measurements. The research was funded by a project granted from grant from Global Innovation Technology Alliance - Department of Science and Technology [GITA/DST/TWN/P-68/2015], Government of India. MRC, MNIT allowed to use the resources for the research work. Software’s used to plot the data was Origin, FullProf and MS Office.

Keywords

  • High energy ball milling
  • MgSiSn Cu doped
  • Microstrural properies
  • Thermoelectric properties

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