Abstract
Rectifying contact formation on n-type bulk single crystal ZnO using novel W 2 B or W 2 B 5 metallization schemes was studied using current-voltage, scanning electron microscopy and Auger electron spectroscopy (AES) measurements. When a single Au overlayer was used to reduce the metal sheet resistance, the contacts were ohmic for all annealing conditions due to outdiffusion of Zn through the metal. By sharp contrast, when a bilayer of Pt/Au was used on top of the boride layers, rectifying contacts with barrier heights of ∼0.4 eV for W 2 B were obtained. The highest barrier height of 0.66 eV was achieved for W 2 B 5 annealed at 600 °C, although at this condition the contact showed a reacted appearance and AES showed almost complete intermixing of the metallization.
Original language | English |
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Pages (from-to) | 1846-1853 |
Number of pages | 8 |
Journal | Applied Surface Science |
Volume | 252 |
Issue number | 5 |
DOIs | |
State | Published - Dec 15 2005 |
Externally published | Yes |
Funding
This research was sponsored by the Army Research Office under grant no. DAAD19-01-1-0603, the Army Research Laboratory, the National Science Foundation (DMR 0101438), and the Air Force Office of Scientific Research.
Funders | Funder number |
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National Science Foundation | DMR 0101438 |
Air Force Office of Scientific Research | |
Army Research Office | DAAD19-01-1-0603 |
Army Research Laboratory |
Keywords
- Auger electron spectroscopy
- Scanning electron microscopy
- Schottky barrier height