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Thermal resistance of interfaces in AlN-diamond thin film composites
K. Jagannadham,
Hsin Wang
Research output
:
Contribution to journal
›
Article
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peer-review
27
Scopus citations
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Dive into the research topics of 'Thermal resistance of interfaces in AlN-diamond thin film composites'. Together they form a unique fingerprint.
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Weight
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Material Science
Diamond
100%
Aluminum Nitride
100%
Heat Resistance
100%
Composite Material
100%
Thin Films
100%
Thermal Conductivity
50%
Composite Films
33%
Silicon
16%
Film
16%
Thermal Resistivity
16%
Diamond Films
16%
Engineering
Diamond
100%
Thin-Film Composite
100%
Heat Resistance
100%
Effective Thermal Conductivity
50%
Layered Structure
33%
Interfacial Thermal Resistance
33%
Experimental Measurement
16%
Deposited Film
16%
Thermal Barrier
16%
Silicon Substrate
16%
Crystalline Quality
16%
Amorphous Region
16%
Physics
Thin Films
100%
Thermal Resistance
100%
Thermal Conductivity
75%
Diamond Films
25%