Thermal properties of wood-derived copper-silicon carbide composites fabricated via electrodeposition

K. E. Pappacena, M. T. Johnson, H. Wang, W. D. Porter, K. T. Faber

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

Copper-silicon carbide composites were fabricated by electrodeposition of copper into pores of wood-derived silicon carbide, a ceramic with a microstructure that can be tailored via the use of different wood precursors. Thermal conductivity values were determined using flash diffusivity at temperatures from 0 to 900 °C. Thermal conductivities of up to 202 W/m K at 0 °C and 148 W/mK at 900 °C were achieved. Object-oriented finite-element analysis (OOF) modeling was used to understand the heat flux distributions throughout the microstructures. OOF was also used to calculate the effective thermal conductivity, which correlated well with experimentally-determined values for axially-oriented composites. In addition, OOF was used to predict effective conductivity values and heat flux distributions for transversely-oriented composites.

Original languageEnglish
Pages (from-to)478-484
Number of pages7
JournalComposites Science and Technology
Volume70
Issue number3
DOIs
StatePublished - Mar 2010
Externally publishedYes

Funding

This work was funded by the National Science Foundation (DMR-0710630). The SEM work was performed in the EPIC facilities of NUANCE Center at Northwestern University. NUANCE Center is supported by NSF-NSEC, NSF-MRSEC, Keck Foundation, the State of Illinois, and Northwestern University. Thermal diffusivity and specific heat experiments were sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy, Office of FreedomCAR and Vehicle Technologies, as part of the High Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle, LLC, for the US Department of Energy under contract Number DE-AC05-00OR22725.

Keywords

  • A. Ceramic-matrix composites (CMCs)
  • B. Thermal properties
  • C. Anisotrophy
  • C. Finite element analysis (FEA)
  • Thermal conductivity

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