Thermal properties of Ti4AlN3

M. W. Barsoum, C. J. Rawn, T. El-Raghy, A. T. Procopio, W. D. Porter, H. Wang, C. R. Hubbard

Research output: Contribution to journalArticlepeer-review

76 Scopus citations

Abstract

In this article we report on the atomic displacement parameters, lattice expansions, heat capacity, and thermal conductivity of samples of Ti4AlN3 in the 298-1370 K temperature range. Rietveld refinement of high temperature neutron diffraction data shows that the nitrogen is substoichiometric and the formula is Ti4AlN2.9. In this structure, the atomic displacement parameters of the Al atoms are higher than those of either the Ti or N atoms. The Ti-N bonds adjacent to the Al planes are about 2.5% shorter than the Ti-N bonds in the inner layers. The thermal expansion coefficients along the a and c axes are, respectively, (9.6±0.1) × 10-6 and (8.8±0.1) × 10-6 K-1. The unit cell expansivity, (9.4±0.1) × 10-6 K-1, is in agreement with the dilatometric bulk thermal expansivity (9.7 ± 0.2) × 10-6K-1. The heat capacity, cp, is 150 J/mol K at ambient temperatures and extrapolates to ≈220 J/mol K at 1300 K. At all temperatures cp equals four times the molar heat capacity of TiN. The room temperature thermal conductivity is 12 W/m K and increases linearly to ≈20 W/m K at 1300 K.

Original languageEnglish
Pages (from-to)8407-8414
Number of pages8
JournalJournal of Applied Physics
Volume87
Issue number12
DOIs
StatePublished - Jun 15 2000

Fingerprint

Dive into the research topics of 'Thermal properties of Ti4AlN3'. Together they form a unique fingerprint.

Cite this