Thermal Properties of the Very Low Thermal Conductivity Ternary Chalcogenide Cu4Bi4M9 (M = S, Se)

Dean Hobbis; Hsin Wang; Joshua Martin; George S. Nolas

doi:10.1002/pssr.202000166

Thermal Properties of the Very Low Thermal Conductivity Ternary Chalcogenide Cu₄Bi₄M₉ (M = S, Se)

Dean Hobbis, Hsin Wang, Joshua Martin, George S. Nolas

Nuclear Energy Materials Microanalysis

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

Temperature-dependent thermal properties of phase-pure polycrystalline ternary chalcogenides Cu₄Bi₄S₉ and Cu₄Bi₄Se₉ are reported. The structure and bonding in these materials result in very low thermal conductivity values (<0.8 W m⁻¹ K⁻¹ at room temperature) for both materials. The lattice contribution, Debye temperatures, and Sommerfeld coefficient are obtained from low-temperature heat capacity data that also indicate very small electronic contributions to the heat capacity for these materials. This study aids in the identification of new nontoxic, earth-abundant resistive ternary chalcogenide materials with low thermal conductivity for potential thermal barrier coating and rewriteable storage applications.

Original language	English
Article number	2000166
Journal	Physica Status Solidi - Rapid Research Letters
Volume	14
Issue number	8
DOIs	https://doi.org/10.1002/pssr.202000166
State	Published - Aug 1 2020

Funding

This work was supported by the National Science Foundation under grant number DMR‐1748188. D.H. acknowledges the II‐VI Foundation Block‐Gift Program. H.W. acknowledges the support of the International Energy Agency (IEA) Advanced Materials for Transportation and the Department of Energy Lightweight and Propulsion Materials program under the Vehicle Technologies Office. Oak Ridge National Laboratory is managed by UT‐Battelle LLC under contract number DE‐AC05000OR22725. This work was supported by the National Science Foundation under grant number DMR-1748188. D.H. acknowledges the II-VI Foundation Block-Gift Program. H.W. acknowledges the support of the International Energy Agency (IEA) Advanced Materials for Transportation and the Department of Energy Lightweight and Propulsion Materials program under the Vehicle Technologies Office. Oak Ridge National Laboratory is managed by UT-Battelle LLC under contract number DE-AC05000OR22725.

Funders	Funder number
II-VI Foundation
II‐VI Foundation
UT-Battelle LLC
National Science Foundation	DMR‐1748188
Oak Ridge National Laboratory
UT-Battelle	DE‐AC05000OR22725
International Atomic Energy Agency
International Energy Agency

Keywords

structure–property relationships
ternary chalcogenides
thermal properties

Access to Document

10.1002/pssr.202000166

Cite this

@article{117b60a565d445789118dd31b9a1cff4,

title = "Thermal Properties of the Very Low Thermal Conductivity Ternary Chalcogenide Cu4Bi4M9 (M = S, Se)",

abstract = "Temperature-dependent thermal properties of phase-pure polycrystalline ternary chalcogenides Cu4Bi4S9 and Cu4Bi4Se9 are reported. The structure and bonding in these materials result in very low thermal conductivity values (<0.8 W m−1 K−1 at room temperature) for both materials. The lattice contribution, Debye temperatures, and Sommerfeld coefficient are obtained from low-temperature heat capacity data that also indicate very small electronic contributions to the heat capacity for these materials. This study aids in the identification of new nontoxic, earth-abundant resistive ternary chalcogenide materials with low thermal conductivity for potential thermal barrier coating and rewriteable storage applications.",

keywords = "structure–property relationships, ternary chalcogenides, thermal properties",

author = "Dean Hobbis and Hsin Wang and Joshua Martin and Nolas, {George S.}",

note = "Publisher Copyright: {\textcopyright} 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim",

year = "2020",

month = aug,

day = "1",

doi = "10.1002/pssr.202000166",

language = "English",

volume = "14",

journal = "Physica Status Solidi - Rapid Research Letters",

issn = "1862-6254",

publisher = "wiley",

number = "8",

}

TY - JOUR

T1 - Thermal Properties of the Very Low Thermal Conductivity Ternary Chalcogenide Cu4Bi4M9 (M = S, Se)

AU - Hobbis, Dean

AU - Wang, Hsin

AU - Martin, Joshua

AU - Nolas, George S.

PY - 2020/8/1

Y1 - 2020/8/1

N2 - Temperature-dependent thermal properties of phase-pure polycrystalline ternary chalcogenides Cu4Bi4S9 and Cu4Bi4Se9 are reported. The structure and bonding in these materials result in very low thermal conductivity values (<0.8 W m−1 K−1 at room temperature) for both materials. The lattice contribution, Debye temperatures, and Sommerfeld coefficient are obtained from low-temperature heat capacity data that also indicate very small electronic contributions to the heat capacity for these materials. This study aids in the identification of new nontoxic, earth-abundant resistive ternary chalcogenide materials with low thermal conductivity for potential thermal barrier coating and rewriteable storage applications.

AB - Temperature-dependent thermal properties of phase-pure polycrystalline ternary chalcogenides Cu4Bi4S9 and Cu4Bi4Se9 are reported. The structure and bonding in these materials result in very low thermal conductivity values (<0.8 W m−1 K−1 at room temperature) for both materials. The lattice contribution, Debye temperatures, and Sommerfeld coefficient are obtained from low-temperature heat capacity data that also indicate very small electronic contributions to the heat capacity for these materials. This study aids in the identification of new nontoxic, earth-abundant resistive ternary chalcogenide materials with low thermal conductivity for potential thermal barrier coating and rewriteable storage applications.

KW - structure–property relationships

KW - ternary chalcogenides

KW - thermal properties

UR - http://www.scopus.com/inward/record.url?scp=85085501310&partnerID=8YFLogxK

U2 - 10.1002/pssr.202000166

DO - 10.1002/pssr.202000166

M3 - Article

AN - SCOPUS:85085501310

SN - 1862-6254

VL - 14

JO - Physica Status Solidi - Rapid Research Letters

JF - Physica Status Solidi - Rapid Research Letters

IS - 8

M1 - 2000166

ER -