Thermal metrology of silicon microstructures using Raman spectroscopy

  • Mark R. Abel
  • , Tanya L. Wright
  • , Erik O. Sunden
  • , Samuel Graham
  • , William P. King
  • , Michael J. Lance

    Research output: Contribution to journalConference articlepeer-review

    17 Scopus citations

    Abstract

    In this work, the effects of temperature and stress on the Raman shift in single crystal silicon and polycrystalline silicon films were calibrated. Polysilicon films were grown by LPCVD using a range of temperatures to produce amorphous and crystalline materials followed by doping and annealing. The dependencies of the linear coefficients were related to the polysilicon microstructure using AFM surface scans to determine any possible links. Finally, the technique was utilized in measuring the temperature distribution in a thermal MEMS cantilever device with micron spatial resolution.

    Original languageEnglish
    Pages (from-to)235-242
    Number of pages8
    JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
    StatePublished - 2005
    Event21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States
    Duration: Mar 15 2005Mar 17 2005

    Keywords

    • MEMS
    • Microscale thermometry
    • Polycrystalline silicon
    • Raman spectroscopy

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