Abstract
In this work, the effects of temperature and stress on the Raman shift in single crystal silicon and polycrystalline silicon films were calibrated. Polysilicon films were grown by LPCVD using a range of temperatures to produce amorphous and crystalline materials followed by doping and annealing. The dependencies of the linear coefficients were related to the polysilicon microstructure using AFM surface scans to determine any possible links. Finally, the technique was utilized in measuring the temperature distribution in a thermal MEMS cantilever device with micron spatial resolution.
Original language | English |
---|---|
Pages (from-to) | 235-242 |
Number of pages | 8 |
Journal | Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
State | Published - 2005 |
Event | 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States Duration: Mar 15 2005 → Mar 17 2005 |
Keywords
- MEMS
- Microscale thermometry
- Polycrystalline silicon
- Raman spectroscopy