Abstract
As inductive wireless power transfer reaches higher power levels; thermal management becomes essential. To address these concerns, past works have demonstrated the benefit of encapsulating coil assemblies with thermally conductive materials and integrating backside liquid cooling into coil assemblies. This work adds to these developments by considering the thermal analysis and construction of a liquid-cooled high power polyphase wireless power transfer ground assembly intended for long duration operation at high power levels, aiming towards hundreds of kW or even 1 MW.
| Original language | English |
|---|---|
| Title of host publication | 2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9798350317664 |
| DOIs | |
| State | Published - 2024 |
| Event | 2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024 - Chicago, United States Duration: Jun 19 2024 → Jun 21 2024 |
Publication series
| Name | 2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024 |
|---|
Conference
| Conference | 2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024 |
|---|---|
| Country/Territory | United States |
| City | Chicago |
| Period | 06/19/24 → 06/21/24 |
Funding
This manuscript has been authored by Oak Ridge National Laboratory, operated by UT-Battelle, LLC, under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. The Department of Energy will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan).
Keywords
- Thermal
- coil design
- encapsulation
- high-power
- liquid-cooling
- polyphase
- wireless power transfer
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