@inproceedings{b884febf82b04e70bbe7335a27cc176d,
title = "Thermal Integration of a High Power Polyphase Inductive Coil Assembly",
abstract = "As inductive wireless power transfer reaches higher power levels; thermal management becomes essential. To address these concerns, past works have demonstrated the benefit of encapsulating coil assemblies with thermally conductive materials and integrating backside liquid cooling into coil assemblies. This work adds to these developments by considering the thermal analysis and construction of a liquid-cooled high power polyphase wireless power transfer ground assembly intended for long duration operation at high power levels, aiming towards hundreds of kW or even 1 MW.",
keywords = "coil design, encapsulation, high-power, liquid-cooling, polyphase, Thermal, wireless power transfer",
author = "Andrew Foote and Erdem Asa and Omer Onar",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024 ; Conference date: 19-06-2024 Through 21-06-2024",
year = "2024",
doi = "10.1109/ITEC60657.2024.10598863",
language = "English",
series = "2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 IEEE Transportation Electrification Conference and Expo, ITEC 2024",
}