Thermal expansion coefficients of low-k dielectric films from Fourier analysis of x-ray reflectivity

C. E. Bouldin, W. E. Wallace, G. W. Lynn, S. C. Roth, W. L. Wu

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Abstract

We determine the thermal expansion coefficient of a fluorinated poly(arylene ether) low-k dielectric film using Fourier analysis of x-ray reflectivity data. The approach is similar to that used in Fourier analysis of x-ray absorption fine structure. The analysis compares two similar samples, or the same sample as an external parameter is varied, and determines the change in film thickness. The analysis process is very accurate and depends on no assumed model. We determine a thermal expansion coefficient of 55±9 × 10-6K-1 using this approach.

Original languageEnglish
Pages (from-to)691-695
Number of pages5
JournalJournal of Applied Physics
Volume88
Issue number2
DOIs
StatePublished - Jul 15 2000
Externally publishedYes

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