Thermal considerations for fiber optic communication components

Peter Fuhr; Hsi Hao Chung

doi:10.1117/12.469830

Thermal considerations for fiber optic communication components

Peter Fuhr, Hsi Hao Chung

Research output: Contribution to journal › Conference article › peer-review

Abstract

The tight tolerances imposed on photonic components for standardized integration into DWDM systems requires that some form of temperature stabilization must be incorporated. Frequently this involves the use of traditional temperature sensors integrated into a classic control-feedback scheme involving thermo-electric coolers. While easy to implement, such a scheme is hardly novel and may result in an inefficient use of electrical power. A technique using flexible thermal tape configured into packages applicable for thermal stabilization of DWDM compliant laser diode sources and tunable filters is described.

Original language	English
Pages (from-to)	36-42
Number of pages	7
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4647
DOIs	https://doi.org/10.1117/12.469830
State	Published - 2002
Externally published	Yes
Event	Functional Integration of Opto-Electro-Mechanical Devices and Systems II - San Jose, CA, United States Duration: Jan 23 2002 → Jan 24 2002

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10.1117/12.469830

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title = "Thermal considerations for fiber optic communication components",

abstract = "The tight tolerances imposed on photonic components for standardized integration into DWDM systems requires that some form of temperature stabilization must be incorporated. Frequently this involves the use of traditional temperature sensors integrated into a classic control-feedback scheme involving thermo-electric coolers. While easy to implement, such a scheme is hardly novel and may result in an inefficient use of electrical power. A technique using flexible thermal tape configured into packages applicable for thermal stabilization of DWDM compliant laser diode sources and tunable filters is described.",

author = "Peter Fuhr and Chung, \{Hsi Hao\}",

year = "2002",

doi = "10.1117/12.469830",

language = "English",

volume = "4647",

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journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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note = "Functional Integration of Opto-Electro-Mechanical Devices and Systems II ; Conference date: 23-01-2002 Through 24-01-2002",

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AU - Chung, Hsi Hao

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N2 - The tight tolerances imposed on photonic components for standardized integration into DWDM systems requires that some form of temperature stabilization must be incorporated. Frequently this involves the use of traditional temperature sensors integrated into a classic control-feedback scheme involving thermo-electric coolers. While easy to implement, such a scheme is hardly novel and may result in an inefficient use of electrical power. A technique using flexible thermal tape configured into packages applicable for thermal stabilization of DWDM compliant laser diode sources and tunable filters is described.

AB - The tight tolerances imposed on photonic components for standardized integration into DWDM systems requires that some form of temperature stabilization must be incorporated. Frequently this involves the use of traditional temperature sensors integrated into a classic control-feedback scheme involving thermo-electric coolers. While easy to implement, such a scheme is hardly novel and may result in an inefficient use of electrical power. A technique using flexible thermal tape configured into packages applicable for thermal stabilization of DWDM compliant laser diode sources and tunable filters is described.

UR - https://www.scopus.com/pages/publications/0036029091

U2 - 10.1117/12.469830

DO - 10.1117/12.469830

M3 - Conference article

AN - SCOPUS:0036029091

SN - 0277-786X

VL - 4647

SP - 36

EP - 42

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Functional Integration of Opto-Electro-Mechanical Devices and Systems II

Y2 - 23 January 2002 through 24 January 2002

ER -

Thermal considerations for fiber optic communication components

Abstract

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