Abstract
The thermal conductivity of thermal interface materials (TIMs) has been studied using a transient plane source (TPS) method. In thermoelectric generators designed for vehicle waste heat recovery, high thermal conductivity materials are needed for the cold-side interface between a polyamide flexible circuit and an aluminum plate heat exchanger. The conventional heat flow method described by ASTM D5470 is often used to determine thermal contact resistance of an interface with a thin layer of interface material. The apparent thermal conductivity values provided by materials manufacturers are used to calculate heat transfer through the interface. However, estimated parameters based on the thermal conductivity of a TIM often do not agree with the actual heat transfer through the interface. Thermal conductivity of a series of 10 commercial TIMs were evaluated by applying a small quantity to an embedded TPS sensor. The 2-mm radius sensor was able to operate under standard bulk material measurement mode and produced consistent thermal conductivity measurements of the interface materials. The TPS method is shown to be effective in ranking the available interface materials by thermal conductivity and to ensure that the material with consistent performance can be selected for the thermoelectric generator applications.
Original language | English |
---|---|
Pages (from-to) | 4697-4705 |
Number of pages | 9 |
Journal | Journal of Electronic Materials |
Volume | 48 |
Issue number | 7 |
DOIs | |
State | Published - Jul 15 2019 |
Funding
Work at ORNL was sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy of the Department of Energy and Vehicle Technologies Program through a Work-for-Others contract with General Motors. Oak Ridge National Laboratory is managed by UT-Battelle LLC under contract DE-AC05000OR22725. Funding was provided by DOE (Grant No. DE-EE0005432).
Funders | Funder number |
---|---|
UT-Battelle LLC | DE-AC05000OR22725 |
U.S. Department of Energy | DE-EE0005432 |
General Motors Corporation | |
Office of Energy Efficiency and Renewable Energy | |
Oak Ridge National Laboratory |
Keywords
- Hot Disk
- Thermal conductivity
- thermal interface material
- transient plane source