Thermal Conductivity of Thermal Interface Materials Evaluated By a Transient Plane Source Method

Hsin Wang, David W. Ihms, Scott D. Brandenburg, James R. Salvador

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

The thermal conductivity of thermal interface materials (TIMs) has been studied using a transient plane source (TPS) method. In thermoelectric generators designed for vehicle waste heat recovery, high thermal conductivity materials are needed for the cold-side interface between a polyamide flexible circuit and an aluminum plate heat exchanger. The conventional heat flow method described by ASTM D5470 is often used to determine thermal contact resistance of an interface with a thin layer of interface material. The apparent thermal conductivity values provided by materials manufacturers are used to calculate heat transfer through the interface. However, estimated parameters based on the thermal conductivity of a TIM often do not agree with the actual heat transfer through the interface. Thermal conductivity of a series of 10 commercial TIMs were evaluated by applying a small quantity to an embedded TPS sensor. The 2-mm radius sensor was able to operate under standard bulk material measurement mode and produced consistent thermal conductivity measurements of the interface materials. The TPS method is shown to be effective in ranking the available interface materials by thermal conductivity and to ensure that the material with consistent performance can be selected for the thermoelectric generator applications.

Original languageEnglish
Pages (from-to)4697-4705
Number of pages9
JournalJournal of Electronic Materials
Volume48
Issue number7
DOIs
StatePublished - Jul 15 2019

Funding

Work at ORNL was sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy of the Department of Energy and Vehicle Technologies Program through a Work-for-Others contract with General Motors. Oak Ridge National Laboratory is managed by UT-Battelle LLC under contract DE-AC05000OR22725. Funding was provided by DOE (Grant No. DE-EE0005432).

FundersFunder number
UT-Battelle LLCDE-AC05000OR22725
U.S. Department of EnergyDE-EE0005432
General Motors Corporation
Office of Energy Efficiency and Renewable Energy
Oak Ridge National Laboratory

    Keywords

    • Hot Disk
    • Thermal conductivity
    • thermal interface material
    • transient plane source

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