The Exascale Framework for High Fidelity coupled Simulations (EFFIS): Enabling whole device modeling in fusion science

Eric Suchyta, Scott Klasky, Norbert Podhorszki, Matthew Wolf, Abolaji Adesoji, C. S. Chang, Jong Choi, Philip E. Davis, Julien Dominski, Stéphane Ethier, Ian Foster, Kai Germaschewski, Berk Geveci, Chris Harris, Kevin A. Huck, Qing Liu, Jeremy Logan, Kshitij Mehta, Gabriele Merlo, Shirley V. MooreTodd Munson, Manish Parashar, David Pugmire, Mark S. Shephard, Cameron W. Smith, Pradeep Subedi, Lipeng Wan, Ruonan Wang, Shuangxi Zhang

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

We present the Exascale Framework for High Fidelity coupled Simulations (EFFIS), a workflow and code coupling framework developed as part of the Whole Device Modeling Application (WDMApp) in the Exascale Computing Project. EFFIS consists of a library, command line utilities, and a collection of run-time daemons. Together, these software products enable users to easily compose and execute workflows that include: strong or weak coupling, in situ (or offline) analysis/visualization/monitoring, command-and-control actions, remote dashboard integration, and more. We describe WDMApp physics coupling cases and computer science requirements that motivate the design of the EFFIS framework. Furthermore, we explain the essential enabling technology that EFFIS leverages: ADIOS for performant data movement, PerfStubs/TAU for performance monitoring, and an advanced COUPLER for transforming coupling data from its native format to the representation needed by another application. Finally, we demonstrate EFFIS using coupled multi-simulation WDMApp workflows and exemplify how the framework supports the project’s needs. We show that EFFIS and its associated services for data movement, visualization, and performance collection does not introduce appreciable overhead to the WDMApp workflow and that the resource-dominant application’s idle time while waiting for data is minimal.

Original languageEnglish
Pages (from-to)106-128
Number of pages23
JournalInternational Journal of High Performance Computing Applications
Volume36
Issue number1
DOIs
StatePublished - Jan 2022

Funding

The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This research was supported by the Exascale Computing Project (17-SC-20-SC), a collaborative effort of the U.S. Department of Energy Office of Science and National Nuclear Security Administration. It used resources of the Oak Ridge Leadership Computing Facility, a DOE Office of Science User Facility supported under Contract DE-AC05-00OR22725.

FundersFunder number
U.S. Department of Energy Office of Science and National Nuclear Security Administration
Office of ScienceDE-AC05-00OR22725

    Keywords

    • ECP
    • Workflows
    • code coupling
    • in situ
    • whole device modeling

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