The electrodeposition of metal at metal/carbon nanotube junctions

Derek W. Austin, Alex A. Puretzky, David B. Geohegan, Phillip F. Britt, Michael A. Guillorn, Michael L. Simpson

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

Abstract

We deposited a semiconducting single-walled carbon nanotube on Pd electrodes, and the initial charge transport measurements showed the usual large contact resistance between the electrodes and the nanotube. We electroplated Au over the electrodes with no obvious deposition of Au along the sidewalls of the nanotube between the electrodes. Post deposition charge transport measurements indicated more than a factor of six decrease in the electrode/nanotube contact resistance, yet the semiconducting behavior of the nanotube was maintained. A significant difference in the post deposition I-V characteristics may be explained by an electronic or mechanical modification of the nanotube/electrode junction.

Original languageEnglish
Pages (from-to)525-529
Number of pages5
JournalChemical Physics Letters
Volume361
Issue number5-6
DOIs
StatePublished - Aug 6 2002

Funding

The authors would like to thank Pam Flemming for her help in preparing the patterned electrode structures. This work was supported under a National Science Foundation Graduate Fellowship and by the Laboratory Directed Research and Development Program of Oak Ridge National Laboratory. The research was carried out at ORNL, managed by UT-Battelle, LLC, for the US Department of Energy under Contract No. DE-AC05-00OR22725, and in part at the Cornell Nanofabrication Facility (a member of the National Nanofabrication Users Network) which is supported by the National Science Foundation under Grant ECS-9731293, its users, Cornell University and Industrial Affiliates.

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