The application of spatial signature analysis to electrical test data: Validation study

TP Karnowski, KW Tobin, SS Gleason, F Lakhani

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageAmerican English
Title of host publicationMetrology, Inspection, And Process Control For Microlithography Xiii, Pts 1 And 2
EditorsB Singh
Pages530-541
Number of pages12
DOIs
StatePublished - 1999

Keywords

  • Automation
  • Electrical test
  • Image processing
  • Process signatures
  • Wafermap analysis
  • Yield learning

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