TY - GEN
T1 - Temperature sensitivity and noise in thermoreflectance thermal imaging
AU - Shakouri, Alexander
AU - El Sayed Kayed, Mohamed
AU - Ziabari, Amirkoushyar
AU - Kendig, Dustin
AU - Vermeersch, Bjorn
AU - Bahk, Je Hyeong
AU - Shakouri, Ali
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/4/30
Y1 - 2015/4/30
N2 - Akin to any experimental system, thermoreflectance thermal imaging is not immune to different sources of noise. Although averaging the thermal images over long times can minimize the impact of the noise on the measurement, electrical, thermal and optical noises can still exist that can, subsequently, affect the accuracy of the temperature measurement. The goal of this work is to systematically look at the noise level in the thermal images obtained by visible wavelength thermoreflectance thermal imaging systems and to identify experimental parameters that can result in most accurate temperature measurements. In particular, we study the impact of the averaging time, selection of the objective lens, binning of the thermal images, signal level and time dependent noise effects in these systems.
AB - Akin to any experimental system, thermoreflectance thermal imaging is not immune to different sources of noise. Although averaging the thermal images over long times can minimize the impact of the noise on the measurement, electrical, thermal and optical noises can still exist that can, subsequently, affect the accuracy of the temperature measurement. The goal of this work is to systematically look at the noise level in the thermal images obtained by visible wavelength thermoreflectance thermal imaging systems and to identify experimental parameters that can result in most accurate temperature measurements. In particular, we study the impact of the averaging time, selection of the objective lens, binning of the thermal images, signal level and time dependent noise effects in these systems.
KW - Image Binning
KW - Noise
KW - Steady State
KW - Thermoreflectance Thermal Imaging
KW - Transient
UR - http://www.scopus.com/inward/record.url?scp=84945178561&partnerID=8YFLogxK
U2 - 10.1109/SEMI-THERM.2015.7100163
DO - 10.1109/SEMI-THERM.2015.7100163
M3 - Conference contribution
AN - SCOPUS:84945178561
T3 - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
SP - 216
EP - 220
BT - 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015
Y2 - 15 March 2015 through 19 March 2015
ER -