TY - GEN
T1 - Surface Merging Technique to Design GA-Optimized Heat Sinks
AU - Barua, Himel
AU - Xue, Lingxiao
AU - Ozpineci, Burak
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - High-power density inverters require efficient and small heat dissipation systems. For liquid cooling systems, an effective heat sink design is important to enable higher heat transfer and keep the pressure drop within reasonable limits. A heat sink geometry generated from an extruded, 1D fast Fourier transform can achieve more even temperature distribution and improved heat transfer than a conventional heat sink. Building on this concept, this paper proposes a new heat sink geometry creation algorithm. Instead of one plane profile being extruded, multiple plane profiles, each created from the fast Fourier transform method, are subsequently merged by smooth surfaces along the flow direction of the heat sink. Thus, a 3D heat sink geometry is created that enables 3D coolant flow and efficient heat transfer. The volume of this design was reduced by 50% compared with pin fin heat sinks. Compared with extruded 1D fast Fourier transform heat sinks, the proposed design showed an approximately 5% device temperature reduction and a 20% pressure drop reduction.
AB - High-power density inverters require efficient and small heat dissipation systems. For liquid cooling systems, an effective heat sink design is important to enable higher heat transfer and keep the pressure drop within reasonable limits. A heat sink geometry generated from an extruded, 1D fast Fourier transform can achieve more even temperature distribution and improved heat transfer than a conventional heat sink. Building on this concept, this paper proposes a new heat sink geometry creation algorithm. Instead of one plane profile being extruded, multiple plane profiles, each created from the fast Fourier transform method, are subsequently merged by smooth surfaces along the flow direction of the heat sink. Thus, a 3D heat sink geometry is created that enables 3D coolant flow and efficient heat transfer. The volume of this design was reduced by 50% compared with pin fin heat sinks. Compared with extruded 1D fast Fourier transform heat sinks, the proposed design showed an approximately 5% device temperature reduction and a 20% pressure drop reduction.
KW - double-sided cooling
KW - flow rate distribution
KW - wide bandgap
UR - http://www.scopus.com/inward/record.url?scp=85182938569&partnerID=8YFLogxK
U2 - 10.1109/ECCE53617.2023.10362624
DO - 10.1109/ECCE53617.2023.10362624
M3 - Conference contribution
AN - SCOPUS:85182938569
T3 - 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023
SP - 6120
EP - 6125
BT - 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023
Y2 - 29 October 2023 through 2 November 2023
ER -