Sub-diffraction thermoreflectance thermal imaging using image reconstruction

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Thermoreflectance thermal imaging technique uses light in the visible wavelength range and has a diffraction limit of ∼250nm. Despite that TR is still capable of acquiring temperature signal from devices smaller in size down to ∼3x below diffraction limit. Below diffraction limit, the detected thermoreflectance signal underestimates the true measured temperature by 360%. Image blurring was used in the forward problem to explain the apparent temperature of the device quite accurately. In most applications, there is no unambiguous model of the device temperature for forward problem and one needs to reconstruct the true temperature profiles of the sub-diffraction devices from their measured TR images. This is an ill-posed inverse problem which may not have a unique solution. Here, a maximum-a-posteriori (MAP) image reconstruction technique is used along with an Iterative Coordinate Descent (ICD) Optimization approach to solve this inverse problem and restore the true temperature profile of the devices. Preliminary results show that temperature of sub-diffraction heater lines down to ∼150nm can be accurately estimated.

Original languageEnglish
Title of host publicationProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages122-127
Number of pages6
ISBN (Electronic)9781509029945
DOIs
StatePublished - Jul 25 2017
Externally publishedYes
Event16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 - Orlando, United States
Duration: May 30 2017Jun 2 2017

Publication series

NameProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017

Conference

Conference16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
Country/TerritoryUnited States
CityOrlando
Period05/30/1706/2/17

Fingerprint

Dive into the research topics of 'Sub-diffraction thermoreflectance thermal imaging using image reconstruction'. Together they form a unique fingerprint.

Cite this