TY - GEN
T1 - Study on adhesive reliability of low-temperature sintered high power LED modules
AU - Li, Xin
AU - Chen, Xu
AU - Yu, Dun Ji
AU - Lu, Guo Quan
PY - 2010
Y1 - 2010
N2 - Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will occur due to thermal expansion coefficient mismatch of chip and substrate. Therefore, it is necessary to study the reliability and failure mechanism of low temperature sintered nano-silver joint. In this study, loading-control shear fatigue tests, temperature cycling and hygrothermal aging tests were conducted on sintered nano-silver paste connected LED modules, through which we made an initial exploration on the mechanical reliability and failure mechanism of this new type of interconnection material.
AB - Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will occur due to thermal expansion coefficient mismatch of chip and substrate. Therefore, it is necessary to study the reliability and failure mechanism of low temperature sintered nano-silver joint. In this study, loading-control shear fatigue tests, temperature cycling and hygrothermal aging tests were conducted on sintered nano-silver paste connected LED modules, through which we made an initial exploration on the mechanical reliability and failure mechanism of this new type of interconnection material.
UR - http://www.scopus.com/inward/record.url?scp=78449282482&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2010.5582818
DO - 10.1109/ICEPT.2010.5582818
M3 - Conference contribution
AN - SCOPUS:78449282482
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 1371
EP - 1376
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -