Stress intensity of delamination in a sintered-silver interconnection

D. J. Devoto, P. P. Paret, A. A. Wereszczak

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)- stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.

Original languageEnglish
Title of host publicationInternational Conference and Exhibition on High Temperature Electronics, HiTEC 2014
PublisherIMAPS-International Microelectronics and Packaging Society
Pages296-303
Number of pages8
ISBN (Electronic)9781634391153
StatePublished - 2014
EventIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014 - Albuquerque, United States
Duration: May 13 2014May 15 2014

Publication series

NameInternational Conference and Exhibition on High Temperature Electronics, HiTEC 2014

Conference

ConferenceIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014
Country/TerritoryUnited States
CityAlbuquerque
Period05/13/1405/15/14

Keywords

  • Bonded interfaces
  • Delamination
  • Reliability
  • Sintered-silver
  • Stress intensity

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