@inproceedings{4bb4fce48cd74ed1b314b2c7fc3ad78a,
title = "Stress intensity of delamination in a sintered-silver interconnection",
abstract = "In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)- stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.",
keywords = "Bonded interfaces, Delamination, Reliability, Sintered-silver, Stress intensity",
author = "Devoto, {D. J.} and Paret, {P. P.} and Wereszczak, {A. A.}",
year = "2014",
language = "English",
series = "International Conference and Exhibition on High Temperature Electronics, HiTEC 2014",
publisher = "IMAPS-International Microelectronics and Packaging Society",
pages = "296--303",
booktitle = "International Conference and Exhibition on High Temperature Electronics, HiTEC 2014",
note = "IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014 ; Conference date: 13-05-2014 Through 15-05-2014",
}