Strain-Driven Stacking Faults in CdSe/CdS Core/Shell Nanorods

Arnaud Demortière, Donovan N. Leonard, Valeri Petkov, Karena Chapman, Soma Chattopadhyay, Chunxing She, David A. Cullen, Tomohiro Shibata, Matthew Pelton, Elena V. Shevchenko

Research output: Contribution to journalArticlepeer-review

32 Scopus citations

Abstract

Colloidal semiconductor nanocrystals are commonly grown with a shell of a second semiconductor material to obtain desired physical properties, such as increased photoluminescence quantum yield. However, the growth of a lattice-mismatched shell results in strain within the nanocrystal, and this strain has the potential to produce crystalline defects. Here, we study CdSe/CdS core/shell nanorods as a model system to investigate the influence of core size and shape on the formation of stacking faults in the nanocrystal. Using a combination of high-angle annular dark-field scanning transmission electron microscopy and pair-distribution-function analysis of synchrotron X-ray scattering, we show that growth of the CdS shell on smaller, spherical CdSe cores results in relatively small strain and few stacking faults. By contrast, growth of the shell on larger, prolate spheroidal cores leads to significant strain in the CdS lattice, resulting in a high density of stacking faults.

Original languageEnglish
Pages (from-to)1900-1906
Number of pages7
JournalJournal of Physical Chemistry Letters
Volume9
Issue number8
DOIs
StatePublished - Apr 19 2018

Funding

This work was performed, in part, at the Center for Nanoscale Materials, a U.S. Department of Energy Office of Science User Facility, under Contract No. DE-AC02-06CH11357. We thank Seth Darling, Jeffrey Guest, Tijana Rajh, Gary Wiederrecht, and Richard Schaller for helpful discussions and David Potterveld and Roy Holt for their input and for initiating the project that led to this work. STEM imaging was performed through a user project supported by ORNL’s Center for Nanophase Materials Sciences (CNMS), which is a DOE Office of Science User Facility.

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