Spray cooling of IGBT devices

Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarioos

Research output: Contribution to journalArticlepeer-review

51 Scopus citations

Abstract

The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent years. In this investigation, a heat flux of 825 W/cm2 at the die was achieved when air-water spray cooling was used to cool IGBTs at high current levels. The junction temperature of the device was measured accurately through voltage-to-temperature characterization. Results from other cooling technologies and other spray cooling experiments were reviewed. A discussion of electrical power losses in IGBTs, due to switching and conduction, is included in this paper. Experiments were conducted on 19 IGBTs, using data collection and software control of the test set. Three types of cooling were explored in this investigation: single-phase convection with water, spray cooling with air-water and spray cooling with steam-water. The results of these experiments show clear advantages of air-water spray cooling IGBTs over other cooling technologies. The applications of spray cooling IGBTs are discussed in open (fixed) and closed (mobile) systems. Current and heat flux levels achieved during this investigation could not have been done using ordinary cooling methods. The techniques used in this investigation clearly demonstrate the superior cooling performance of air-water spray cooling over traditionell cooling methods.

Original languageEnglish
Pages (from-to)316-323
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume129
Issue number3
DOIs
StatePublished - Sep 2007
Externally publishedYes

Keywords

  • High heat flux
  • High power
  • IGBTs
  • Spray cooling

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