Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

Douglas H. Lowndes; M. Desilva; M. J. Godbole; A. J. Pedraza; T. Thundat; R. J. Warmack

doi:10.1063/1.111810

Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

Douglas H. Lowndes
, M. Desilva
, M. J. Godbole
, A. J. Pedraza
, T. Thundat
, R. J. Warmack

Sensors and Electronics

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

Original language	English
Pages (from-to)	1791-1793
Number of pages	3
Journal	Applied Physics Letters
Volume	64
Issue number	14
DOIs	https://doi.org/10.1063/1.111810
State	Published - 1994

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title = "Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing",

abstract = "Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200\%-400\%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.",

author = "Lowndes, \{Douglas H.\} and M. Desilva and Godbole, \{M. J.\} and Pedraza, \{A. J.\} and T. Thundat and Warmack, \{R. J.\}",

year = "1994",

doi = "10.1063/1.111810",

language = "English",

volume = "64",

pages = "1791--1793",

journal = "Applied Physics Letters",

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publisher = "American Institute of Physics",

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T1 - Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

AU - Lowndes, Douglas H.

AU - Desilva, M.

AU - Godbole, M. J.

AU - Pedraza, A. J.

AU - Thundat, T.

AU - Warmack, R. J.

PY - 1994

Y1 - 1994

N2 - Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

AB - Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

UR - https://www.scopus.com/pages/publications/0028763821

U2 - 10.1063/1.111810

DO - 10.1063/1.111810

M3 - Article

AN - SCOPUS:0028763821

SN - 0003-6951

VL - 64

SP - 1791

EP - 1793

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 14

ER -

Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

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