Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

Douglas H. Lowndes; M. Desilva; M. J. Godbole; A. J. Pedraza; T. Thundat; R. J. Warmack

doi:10.1063/1.111810

Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

Douglas H. Lowndes, M. Desilva, M. J. Godbole, A. J. Pedraza, T. Thundat, R. J. Warmack

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19 Scopus citations

Abstract

Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

Original language	English
Pages (from-to)	1791-1793
Number of pages	3
Journal	Applied Physics Letters
Volume	64
Issue number	14
DOIs	https://doi.org/10.1063/1.111810
State	Published - 1994
Externally published	Yes

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title = "Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing",

abstract = "Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.",

author = "Lowndes, {Douglas H.} and M. Desilva and Godbole, {M. J.} and Pedraza, {A. J.} and T. Thundat and Warmack, {R. J.}",

year = "1994",

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AU - Lowndes, Douglas H.

AU - Desilva, M.

AU - Godbole, M. J.

AU - Pedraza, A. J.

AU - Thundat, T.

AU - Warmack, R. J.

PY - 1994

Y1 - 1994

N2 - Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

AB - Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

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VL - 64

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JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 14

ER -

Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

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