Sintering Kinetics of Inkjet-Printed Conductive Silver Lines on Insulating Plastic Substrate

Wenchao Zhou, Frederick A. List, Chad E. Duty, Sudarsanam S. Babu

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

This paper focuses on sintering kinetics of inkjet-printed lines containing silver nanoparticles deposited on a plastic substrate. Upon heat treatment, the change of resistance in the printed lines was measured as a function of time and sintering temperatures from 423 K to 473 K (150 °C to 200 °C). A new phenomenon was observed that a critical temperature existed for the sintering process, beyond which there was no further reduction in resistance. Experimental evidence and analysis show the critical temperature is associated with the boiling point of the solvent. New sintering mechanisms have been proposed to explain the observed phenomenon, including accelerated diffusion facilitated by the existence of liquid solution based on the theory of liquid phase sintering, and particle collision and coalescence caused by the induced liquid flows in the solution. The proposed theory suggest new means can be devised to improve the sintering results for inkjet-printed lines and other applications.

Original languageEnglish
Article number288
Pages (from-to)1542-1547
Number of pages6
JournalMetallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science
Volume46
Issue number3
DOIs
StatePublished - Jun 26 2015

Funding

This work is sponsored by the U.S. Department of Energy, Office of Energy Efficiency and Renewable Energy, Advanced Manufacturing Office, under contract DE-AC05-00OR22725 with UT-Battelle, LLC.

FundersFunder number
U.S. Department of Energy
Advanced Manufacturing OfficeDE-AC05-00OR22725
Office of Energy Efficiency and Renewable Energy

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