Abstract
The main purpose of this investigation is to develop a mathematical relationship for the flow strength based on microstructure evolution during the hot forming of titanium aluminide. For engineering applications, gamma titanium-aluminide which is composed of 46-50 at.% Al is desired in a duplex grain microstructure. Thermomechanical processing of this alloy requires a temperature of 0.60-0.75 TM (melting point) in order to properly control the microstructure and grain growth. Compression tests were conducted in the temperature range between 950-1100°C at strain rates of 0.001/s and 0.1/s to develop a duplex phase microstructure, gamma with 5-20% α2. By using the experimental data, mathematical relationships were verified for different stages of hardening, recovery, recrystallization, and grain growth. The simulation was based on the theory used in the Sandstrom and Lagneborg model and the numerical analysis approach developed by Pietrzyk. The simulation proved that the model and numerical simulation well-presented the compression deformation of titanium-aluminide alloys at constant strain rates.
Original language | English |
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Pages (from-to) | 5697-5704 |
Number of pages | 8 |
Journal | Journal of Materials Science |
Volume | 36 |
Issue number | 23 |
DOIs | |
State | Published - Dec 1 2001 |
Funding
This research was partially supported by NASA-John Glenn Research Center, Cleveland, Ohio under the grant number NAG3-1825 from. The research at ORNL is sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy, Office of Transportation Technologies, as part of the High Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle, LLC for the U.S. Department of Energy under contract number DE-AC05-000R22725.
Funders | Funder number |
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NASA-John Glenn Research Center, Cleveland, Ohio | NAG3-1825 |
Office of Transportation Technologies | |
U.S. Department of Energy | DE-AC05-000R22725 |
Office of Energy Efficiency and Renewable Energy | |
Oak Ridge National Laboratory | |
UT-Battelle |