Silicon-doped β -Ga2O3films grown at 1 μ m/h by suboxide molecular-beam epitaxy

Kathy Azizie, Felix V.E. Hensling, Cameron A. Gorsak, Yunjo Kim, Naomi A. Pieczulewski, Daniel M. Dryden, M. K.Indika Senevirathna, Selena Coye, Shun Li Shang, Jacob Steele, Patrick Vogt, Nicholas A. Parker, Yorick A. Birkhölzer, Jonathan P. McCandless, Debdeep Jena, Huili G. Xing, Zi Kui Liu, Michael D. Williams, Andrew J. Green, Kelson ChabakDavid A. Muller, Adam T. Neal, Shin Mou, Michael O. Thompson, Hari P. Nair, Darrell G. Schlom

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45 Scopus citations

Abstract

We report the use of suboxide molecular-beam epitaxy (S-MBE) to grow β-Ga2O3 at a growth rate of ∼1 μm/h with control of the silicon doping concentration from 5 × 1016 to 1019 cm-3. In S-MBE, pre-oxidized gallium in the form of a molecular beam that is 99.98% Ga2O, i.e., gallium suboxide, is supplied. Directly supplying Ga2O to the growth surface bypasses the rate-limiting first step of the two-step reaction mechanism involved in the growth of β-Ga2O3 by conventional MBE. As a result, a growth rate of ∼1 μm/h is readily achieved at a relatively low growth temperature (Tsub ≈ 525 °C), resulting in films with high structural perfection and smooth surfaces (rms roughness of <2 nm on ∼1 μm thick films). Silicon-containing oxide sources (SiO and SiO2) producing an SiO suboxide molecular beam are used to dope the β-Ga2O3 layers. Temperature-dependent Hall effect measurements on a 1 μm thick film with a mobile carrier concentration of 2.7 × 1017 cm-3 reveal a room-temperature mobility of 124 cm2 V-1 s-1 that increases to 627 cm2 V-1 s-1 at 76 K; the silicon dopants are found to exhibit an activation energy of 27 meV. We also demonstrate working metal-semiconductor field-effect transistors made from these silicon-doped β-Ga2O3 films grown by S-MBE at growth rates of ∼1 μm/h.

Original languageEnglish
Article number041102
JournalAPL Materials
Volume11
Issue number4
DOIs
StatePublished - Apr 1 2023
Externally publishedYes

Funding

K.A., C.A.G., N.A.P., J.S., J.P.M., D.J., H.G.X., D.A.M., M.O.T., H.P.N., and D.G.S. acknowledge the support from the AFOSR/AFRL ACCESS Center of Excellence under Award No. FA9550-18-1-0529. J.P.M. also acknowledges the support from the National Science Foundation within a Graduate Research Fellowship under Grant No. DGE-1650441. P.V. and Y.A.B. acknowledge the support from ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. F.V.E.H. acknowledges the support from the Alexander von Humboldt Foundation in the form of a Feodor Lynen fellowship. F.V.E.H. also acknowledges the support from the National Science Foundation (NSF) [Platform for the Accelerated Realization, Analysis and Discovery of Interface Materials (PARADIM)] under Cooperative Agreement No. DMR-1539918. M.D.W., D.A.M., and D.G.S. acknowledge the support from the NSF under DMR-2122147. M.D.W. also acknowledges NSF Grant No. HRD-1924204 and ONR Award No. N00014-21-1-2823. This work made use of the Cornell Center for Materials Research (CCMR) Shared Facilities, which are supported through the NSF MRSEC Program (Grant No. DMR-1719875). The substrate preparation was performed, in part, at the Cornell NanoScale Facility, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), which is supported by the NSF (Grant No. NNCI-2025233). This work also made use of the Cornell Energy Systems Institute Shared Facilities partly sponsored by the NSF (Grant No. MRI DMR-1338010).

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