Si-based MEMS resonant sensor: A review from microfabrication perspective

Gulshan Verma; Kunal Mondal; Ankur Gupta

doi:10.1016/j.mejo.2021.105210

Si-based MEMS resonant sensor: A review from microfabrication perspective

Gulshan Verma, Kunal Mondal, Ankur Gupta

Research output: Contribution to journal › Article › peer-review

35 Scopus citations

Abstract

With the technological advancement in micro-electro-mechanical systems (MEMS), microfabrication processes along with digital electronics together have opened novel avenues to the development of small-scale smart sensing devices with improved sensitivity with a lower cost of fabrication and relatively small power consumption. This article aims to provide the overview of the recent work carried out on the fabrication methodologies adopted to develop silicon based resonant sensors. A detailed discussion has been carried out to understand critical steps involved in the fabrication of the silicon-based MEMS resonator. Some challenges starting from the materials' selection to the final phase of obtaining a compact MEMS resonator device for its fabrication have also been explored critically.

Original language	English
Article number	105210
Journal	Microelectronics Journal
Volume	118
DOIs	https://doi.org/10.1016/j.mejo.2021.105210
State	Published - Dec 2021
Externally published	Yes

Funding

Wang et al. [152] demonstrated fabrication steps for the wavelength sized micro-disk type resonator in Silicon carbide thin-film-on-insulation (SiCOI). Fig. 15 shows the micro-manufacturing of the micro-disk resonator initiated with a 300 nm thick methyl methacrylate (MMA) layer and poly methyl methacrylate layer (PMMA) were spin coated onto the SiCOI wafer. The micro-disk patterns are structured using an electron beam lithography. After placing the wafer having solution of methyl isobutyl ketone and isopropyl alcohol in a ratio of 3:1 for ∼45s, a thick film of Cr has been deposited. The micro-disk structures are then released by dry etching via inductively coupled plasma reactive ion etching (ICP-RIE). Followed by the removal of BOX layer via HF acid to release a supporting pedestal.Corresponding author would like to acknowledge the affiliating institute (IIT Jodhpur) to provide the research seed grant (I/SEED/AKG/20190022) and Start Research Grant (SRG/2020/001895) provided by Science and Engineering Research Board, Department of Science and Technology, India. Corresponding author would like to acknowledge the affiliating institute ( IIT Jodhpur) to provide the research seed grant ( I/SEED/AKG/20190022 ) and Start Research Grant ( SRG/2020/001895 ) provided by Science and Engineering Research Board , Department of Science and Technology , India.

Funders	Funder number
SiCOI	I/SEED/AKG/20190022, SRG/2020/001895
Department of Science and Technology, Ministry of Science and Technology, India
Science and Engineering Research Board
Department of Science and Technology, Government of Kerala

Keywords

Application of MEMS
Design and packaging of MEMS device
Fabrication
MEMS

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10.1016/j.mejo.2021.105210

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title = "Si-based MEMS resonant sensor: A review from microfabrication perspective",

abstract = "With the technological advancement in micro-electro-mechanical systems (MEMS), microfabrication processes along with digital electronics together have opened novel avenues to the development of small-scale smart sensing devices with improved sensitivity with a lower cost of fabrication and relatively small power consumption. This article aims to provide the overview of the recent work carried out on the fabrication methodologies adopted to develop silicon based resonant sensors. A detailed discussion has been carried out to understand critical steps involved in the fabrication of the silicon-based MEMS resonator. Some challenges starting from the materials' selection to the final phase of obtaining a compact MEMS resonator device for its fabrication have also been explored critically.",

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year = "2021",

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doi = "10.1016/j.mejo.2021.105210",

language = "English",

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AU - Verma, Gulshan

AU - Mondal, Kunal

AU - Gupta, Ankur

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Y1 - 2021/12

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AB - With the technological advancement in micro-electro-mechanical systems (MEMS), microfabrication processes along with digital electronics together have opened novel avenues to the development of small-scale smart sensing devices with improved sensitivity with a lower cost of fabrication and relatively small power consumption. This article aims to provide the overview of the recent work carried out on the fabrication methodologies adopted to develop silicon based resonant sensors. A detailed discussion has been carried out to understand critical steps involved in the fabrication of the silicon-based MEMS resonator. Some challenges starting from the materials' selection to the final phase of obtaining a compact MEMS resonator device for its fabrication have also been explored critically.

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KW - Design and packaging of MEMS device

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SN - 0026-2692

VL - 118

JO - Microelectronics Journal

JF - Microelectronics Journal

M1 - 105210

ER -

Si-based MEMS resonant sensor: A review from microfabrication perspective

Abstract

Funding

Keywords

UN SDGs

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