Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval

Jeffery R. Price; Philip R. Bingham; Kenneth W. Tobin; Thomas P. Karnowski

doi:10.1117/12.514963

Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval

Jeffery R. Price, Philip R. Bingham, Kenneth W. Tobin, Thomas P. Karnowski

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Abstract

We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.

Original language	English
Pages (from-to)	209-219
Number of pages	11
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	5132
DOIs	https://doi.org/10.1117/12.514963
State	Published - 2003
Event	Sixth International Conference on Quality Control by Artificial Vision - Gatlinburg, TN, United States Duration: May 19 2003 → May 22 2003

Keywords

CD-SEM metrology
Linear discriminant analysis (LDA)
Lithography
Semiconductor inspection

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10.1117/12.514963

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@article{42cb9da34fff4c49a4986061cb53bc28,

title = "Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval",

abstract = "We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.",

keywords = "CD-SEM metrology, Linear discriminant analysis (LDA), Lithography, Semiconductor inspection",

author = "Price, {Jeffery R.} and Bingham, {Philip R.} and Tobin, {Kenneth W.} and Karnowski, {Thomas P.}",

year = "2003",

doi = "10.1117/12.514963",

language = "English",

volume = "5132",

pages = "209--219",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "Society of Photo-Optical Instrumentation Engineers",

note = "Sixth International Conference on Quality Control by Artificial Vision ; Conference date: 19-05-2003 Through 22-05-2003",

}

TY - JOUR

T1 - Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval

AU - Price, Jeffery R.

AU - Bingham, Philip R.

AU - Tobin, Kenneth W.

AU - Karnowski, Thomas P.

PY - 2003

Y1 - 2003

N2 - We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.

AB - We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.

KW - CD-SEM metrology

KW - Linear discriminant analysis (LDA)

KW - Lithography

KW - Semiconductor inspection

UR - http://www.scopus.com/inward/record.url?scp=0344037109&partnerID=8YFLogxK

U2 - 10.1117/12.514963

DO - 10.1117/12.514963

M3 - Conference article

AN - SCOPUS:0344037109

SN - 0277-786X

VL - 5132

SP - 209

EP - 219

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Sixth International Conference on Quality Control by Artificial Vision

Y2 - 19 May 2003 through 22 May 2003

ER -

Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval

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