Room-Temperature Activation of InGaZnO Thin-Film Transistors via He+ Irradiation

Michael G. Stanford, Joo Hyon Noh, Kyle Mahady, Anton V. Ievlev, Peter Maksymovych, Olga S. Ovchinnikova, Philip D. Rack

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

Amorphous indium gallium zinc oxide (a-IGZO) is a transparent semiconductor which has demonstrated excellent electrical performance as thin-film transistors (TFTs). However, a high-temperature activation process is generally required which is incompatible for next-generation flexible electronic applications. In this work, He+ irradiation is demonstrated as an athermal activation process for a-IGZO TFTs. Controlling the He+ dose enables the tuning of charge density, and a dose of 1 × 1014 He+/cm2 induces a change in charge density of 2.3 × 1012 cm-2. Time-dependent transport measurements and time-of-flight secondary ion mass spectroscopy (ToF-SIMS) indicate that the He+-induced trapped charge is introduced because of preferential oxygen-vacancy generation. Scanning microwave impedance microscopy confirms that He+ irradiation improves the conductivity of the a-IGZO. For realization of a permanent activation, IGZO was exposed with a He+ dose of 5 × 1014 He+/cm2 and then aged 24 h to allow decay of the trapped oxide charge originating for electron-hole pair generation. The resultant shift in the charge density is primarily attributed to oxygen vacancies generated by He+ sputtering in the near-surface region.

Original languageEnglish
Pages (from-to)35125-35132
Number of pages8
JournalACS Applied Materials and Interfaces
Volume9
Issue number40
DOIs
StatePublished - Oct 11 2017

Funding

*E-mail: [email protected]. ORCID Michael G. Stanford: 0000-0001-9663-1138 Anton V. Ievlev: 0000-0003-3645-0508 Author Contributions §M.G.S. and J.H.N. are co-first authors. Funding This manuscript has been authored by UT-Battelle, LLC, under Contract DE-AC05-00OR22725 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. The Department of Energy will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan). Notes The authors declare no competing financial interest. P.D.R. and J.H.N. acknowledge support from the National Science Foundation under Grant CNS 1544686. M.G.S. acknowledges support from the US Department of Energy (DOE) under Grant DOE DE-SC0002136. P.D.R., O.S.O., A.V.I., J.H.N., and M.G.S. acknowledge that the IGZO transistor fabrication, helium-ion microscope exposures, ToF-SIMS, and scanning microwave microscopy was conducted at the Center for Nanophase Materials Sciences, which is a DOE Office of Science User Facility under user proposal CNMS2016-216.

Keywords

  • IGZO
  • athermal
  • flexible electronics
  • helium ion
  • low-temperature activation
  • transistors

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