Resistance degradation of CVD (Ba,Sr)TiO3 thin films for DRAMs and integrated decoupling capacitors

C. Basceri, M. A. Wells, S. K. Streiffer, A. I. Kingon, S. Bilodeau, R. Carl, P. C. van Buskirk, S. R. Summerfelt, P. McIntyre

Research output: Contribution to conferencePaperpeer-review

3 Scopus citations

Abstract

We have investigated the important failure mechanism of resistance degradation for polycrystalline MOCVD (Ba, Sr)TiO3 thin films appropriate for use in DRAMs, as a function of voltage (field), thickness and temperature. At constant field, the measured degradation lifetime decreases with increasing film thickness, resulting from a decrease in the activation energy with respect to temperature for thicker films. Similarly, there are clear indications that thicker films are more field sensitive. Predicted resistance degradation lifetimes obtained from both temperature and voltage extrapolations for DRAM operating conditions of 85 °C and 1.6 V exceed the current benchmark of 10 years for all the films studied.

Original languageEnglish
Pages51-54
Number of pages4
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 10th IEEE International Symposium on Applications of Ferroelectrics, ISAF. Part 1 (of 2) - East Brunswick, NJ, USA
Duration: Aug 18 1996Aug 21 1996

Conference

ConferenceProceedings of the 1996 10th IEEE International Symposium on Applications of Ferroelectrics, ISAF. Part 1 (of 2)
CityEast Brunswick, NJ, USA
Period08/18/9608/21/96

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