Residual Stress Measurements

T. R. Watkins, G. S. Schajer, M. J. Lance

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

This chapter discusses major methods for determining residual stresses. It provides the reader with a starting point for residual stress characterization, an understanding of what measurements are possible, and sufficient guidance to select an appropriate measurement method. After a brief introduction to residual stresses, sections are dedicated to some of the more common methods of measuring residual stresses, including diffraction, hole-drilling, and piezospectroscopy. Each section briefly overviews the fundamentals of each method, typical equipment needed, and analyses employed. Key references are mentioned and cited, and examples are shown. The limitations of each method, cautions, safety concerns, calibrations, caveats, and other relevant topics, are discussed.

Original languageEnglish
Title of host publicationComprehensive Materials Processing
Subtitle of host publicationThirteen Volume Set
PublisherElsevier
PagesV1-113-V1-134
Volume1
ISBN (Electronic)9780080965338
ISBN (Print)9780080965321
DOIs
StatePublished - Jan 1 2014

Keywords

  • Deep hole
  • Hole-drilling
  • Neutron diffraction
  • Piezo-Raman
  • Piezoluminescence
  • Piezospectroscopy
  • Residual strain
  • Residual stress
  • Ring-core
  • Synchrotron
  • X-ray diffraction

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