TY - GEN
T1 - Reliability of Sn-3.5Ag solder joints in high temperature packaging applications
AU - Muralidharan, Govindarajan
AU - Kurumaddali, Kanth
AU - Kercher, Andrew K.
AU - Leslie, Scott G.
PY - 2010
Y1 - 2010
N2 - There is a significant need for next-generation, highperformance power electronic packages and systems with wide band gap devices that operate at high temperatures in automotive and electric grid applications. Sn-3.5Ag solder is a candidate for use in such packages with potential operating temperatures up to 200°C. However, there is a need to understand thermal cycling reliability of Sn-3.5Ag solders. The results of a study on the damage evolution occurring in large area Sn-3.5Ag solder joints between silicon dies and Direct Bonded Copper (DBC) substrates subject to thermal cycling between 200°C and 5°C is presented in this paper. Damage accumulation was followed using high resolution Xray radiography techniques, and nonlinear finite element models were developed based on the mechanical property data available in literature to understand the relationship between the stress state within the solder joint and the damage occurring under thermal cycling conditions. It was observed that regions of damage observed in the experiments do not correspond to the finite element predictions of the location of regions of maximum plastic work.
AB - There is a significant need for next-generation, highperformance power electronic packages and systems with wide band gap devices that operate at high temperatures in automotive and electric grid applications. Sn-3.5Ag solder is a candidate for use in such packages with potential operating temperatures up to 200°C. However, there is a need to understand thermal cycling reliability of Sn-3.5Ag solders. The results of a study on the damage evolution occurring in large area Sn-3.5Ag solder joints between silicon dies and Direct Bonded Copper (DBC) substrates subject to thermal cycling between 200°C and 5°C is presented in this paper. Damage accumulation was followed using high resolution Xray radiography techniques, and nonlinear finite element models were developed based on the mechanical property data available in literature to understand the relationship between the stress state within the solder joint and the damage occurring under thermal cycling conditions. It was observed that regions of damage observed in the experiments do not correspond to the finite element predictions of the location of regions of maximum plastic work.
UR - http://www.scopus.com/inward/record.url?scp=77955200766&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2010.5490717
DO - 10.1109/ECTC.2010.5490717
M3 - Conference contribution
AN - SCOPUS:77955200766
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1823
EP - 1829
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -