Reliability assessment of high density multi-layer board assembly using shadow Moiré and luminescence spectroscopy

S. Bansal, P. Markondeya Raj, K. Shinotani, S. Bhattacharya, R. Tummala, M. J. Lance

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Novel low CTE-high stiffness organic and inorganic boards were evaluated for flip-chip on board technology without underfill. Standard liquid-liquid thermal shock tests were carried out on test vehicles with different board materials and failure modes were characterized. In-situ warpage and stress measurements were made to analyze the observed failure modes and to set guidelines for optimal board material selection. The effect of interlayer dielectric thickness on the package reliability has also been studied. The reliability test results are in accordance with the inferences from the in-situ warpage and stress measurements and it can be concluded that along with low CTE, high modulus is an inevitable substrate property requirement for flip-chip reliability without underfill in next-generation packages. This paper also presents photostimulated luminescence spectroscopy as a nondestructive and direct technique for the in-situ stress measurement in microsystems and thus a powerful means for reliability assessment.

Original languageEnglish
Title of host publicationProceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
EditorsMahadevan K. Iyer, Kok Chuan Toh, Charles Lee
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages126-132
Number of pages7
ISBN (Electronic)0780374355, 9780780374355
DOIs
StatePublished - 2002
Externally publishedYes
Event4th Electronics Packaging Technology Conference, EPTC 2002 - Singapore, Singapore
Duration: Dec 10 2002Dec 12 2002

Publication series

NameProceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Conference

Conference4th Electronics Packaging Technology Conference, EPTC 2002
Country/TerritorySingapore
CitySingapore
Period12/10/0212/12/02

Funding

The work was supported by National Science Foundation through GeoGia Tech/NSF-Packaging Research Center (EEC-9402723). MJL was sponsored by the U.S. Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering, under contract DErAC05-000R22725 with UT-Battelle, LLC. The authors would like to acknowledge Akrometrix LLC, Atlanta, GA for making the in-situ Shadow Moire warpage measurements. The authors also wish to thank Toray Industries Inc., Japan for supplying the carbon boards, the PRC Research Staff and Research Engineer, Corey Franzo of CBAR Lab at Georgia Tech for their assistance. The work was supported by National Science Foundation through Georgia Tech/NSF-Packaging Research Center (EEC-9402723). MJL was sponsored by the U.S. Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering, under contract DE-AC05-00OR22725 with UT-Battelle, LLC. The authors would like to acknowledge Akrometrix LLC, Atlanta, GA for making the in-situ Shadow Moiré warpage measurements. The authors also wish to thank Toray Industries Inc., Japan for supplying the carbon boards, the PRC Research Staff and Research Engineer, Corey Franzo of CBAR Lab at Georgia Tech for their assistance.

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