Abstract
Novel low CTE-high stiffness organic and inorganic boards were evaluated for flip-chip on board technology without underfill. Standard liquid-liquid thermal shock tests were carried out on test vehicles with different board materials and failure modes were characterized. In-situ warpage and stress measurements were made to analyze the observed failure modes and to set guidelines for optimal board material selection. The effect of interlayer dielectric thickness on the package reliability has also been studied. The reliability test results are in accordance with the inferences from the in-situ warpage and stress measurements and it can be concluded that along with low CTE, high modulus is an inevitable substrate property requirement for flip-chip reliability without underfill in next-generation packages. This paper also presents photostimulated luminescence spectroscopy as a nondestructive and direct technique for the in-situ stress measurement in microsystems and thus a powerful means for reliability assessment.
Original language | English |
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Title of host publication | Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002 |
Editors | Mahadevan K. Iyer, Kok Chuan Toh, Charles Lee |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 126-132 |
Number of pages | 7 |
ISBN (Electronic) | 0780374355, 9780780374355 |
DOIs | |
State | Published - 2002 |
Externally published | Yes |
Event | 4th Electronics Packaging Technology Conference, EPTC 2002 - Singapore, Singapore Duration: Dec 10 2002 → Dec 12 2002 |
Publication series
Name | Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002 |
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Conference
Conference | 4th Electronics Packaging Technology Conference, EPTC 2002 |
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Country/Territory | Singapore |
City | Singapore |
Period | 12/10/02 → 12/12/02 |
Funding
The work was supported by National Science Foundation through GeoGia Tech/NSF-Packaging Research Center (EEC-9402723). MJL was sponsored by the U.S. Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering, under contract DErAC05-000R22725 with UT-Battelle, LLC. The authors would like to acknowledge Akrometrix LLC, Atlanta, GA for making the in-situ Shadow Moire warpage measurements. The authors also wish to thank Toray Industries Inc., Japan for supplying the carbon boards, the PRC Research Staff and Research Engineer, Corey Franzo of CBAR Lab at Georgia Tech for their assistance. The work was supported by National Science Foundation through Georgia Tech/NSF-Packaging Research Center (EEC-9402723). MJL was sponsored by the U.S. Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering, under contract DE-AC05-00OR22725 with UT-Battelle, LLC. The authors would like to acknowledge Akrometrix LLC, Atlanta, GA for making the in-situ Shadow Moiré warpage measurements. The authors also wish to thank Toray Industries Inc., Japan for supplying the carbon boards, the PRC Research Staff and Research Engineer, Corey Franzo of CBAR Lab at Georgia Tech for their assistance.