Release behavior for powder injection molding in stereolithography molds

James G. Hemrick; Thomas L. Starr; David W. Rosen

doi:10.1108/13552540110386772

Release behavior for powder injection molding in stereolithography molds

James G. Hemrick, Thomas L. Starr, David W. Rosen

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one-dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.

Original language	English
Pages (from-to)	115-121
Number of pages	7
Journal	Rapid Prototyping Journal
Volume	7
Issue number	2
DOIs	https://doi.org/10.1108/13552540110386772
State	Published - 2001
Externally published	Yes

Keywords

Adhesion
Injection molding
Rapid prototyping
Rapid tooling
Stereolithography

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10.1108/13552540110386772

Cite this

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title = "Release behavior for powder injection molding in stereolithography molds",

abstract = "Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one-dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.",

keywords = "Adhesion, Injection molding, Rapid prototyping, Rapid tooling, Stereolithography",

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year = "2001",

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language = "English",

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pages = "115--121",

journal = "Rapid Prototyping Journal",

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number = "2",

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T1 - Release behavior for powder injection molding in stereolithography molds

AU - Hemrick, James G.

AU - Starr, Thomas L.

AU - Rosen, David W.

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N2 - Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one-dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.

AB - Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one-dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.

KW - Adhesion

KW - Injection molding

KW - Rapid prototyping

KW - Rapid tooling

KW - Stereolithography

UR - https://www.scopus.com/pages/publications/0034915636

U2 - 10.1108/13552540110386772

DO - 10.1108/13552540110386772

M3 - Article

AN - SCOPUS:0034915636

SN - 1355-2546

VL - 7

SP - 115

EP - 121

JO - Rapid Prototyping Journal

JF - Rapid Prototyping Journal

IS - 2

ER -

Release behavior for powder injection molding in stereolithography molds

Abstract

Keywords

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