Release behavior for powder injection molding in stereolithography molds

James G. Hemrick, Thomas L. Starr, David W. Rosen

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one-dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.

Original languageEnglish
Pages (from-to)115-121
Number of pages7
JournalRapid Prototyping Journal
Volume7
Issue number2
DOIs
StatePublished - 2001
Externally publishedYes

Keywords

  • Adhesion
  • Injection molding
  • Rapid prototyping
  • Rapid tooling
  • Stereolithography

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