Abstract
Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one-dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.
Original language | English |
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Pages (from-to) | 115-121 |
Number of pages | 7 |
Journal | Rapid Prototyping Journal |
Volume | 7 |
Issue number | 2 |
DOIs | |
State | Published - 2001 |
Externally published | Yes |
Keywords
- Adhesion
- Injection molding
- Rapid prototyping
- Rapid tooling
- Stereolithography