Refrigerant subcooling correlations for different expansion devices for a non-intrusive charge indicator

Z. Gao, V. C. Mei

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The most common problems affecting residential and light commercial heating, ventilation, and air-conditioning (HVAC) systems are slow refrigerant leaks. Equipment users are usually not aware of the problem until most of the refrigerant has escaped. A low-cost, non-intrusive refrigerant charge indicator has been developed, based on temperature measurements and correlations formed to interpret the measured temperatures. It can be used to provide real time warnings to the equipment users before the majority of refrigerant is escaped. It could be inexpensive and easy to incorporate into existing heat pumps and air conditioners. Extensive laboratory experimental work was performed on a 2-ton window air conditioner and on a 2.5 ton split heat pump system. It was found that the heat pump was not sensitive to slow refrigerant leak because of the long liquid line. Liquid subcooling was measured to determine the system charge status before a substantial amount of refrigerant was leaked. This study reports the finding of correlations formed for liquid subcooling for the orifice plate and thermal expansion valve used on the heat pump system for both heating and cooling mode operation.

Original languageEnglish
Title of host publicationProceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Advanced Energy Systems Division
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)0791837904, 9780791837900
DOIs
StatePublished - 2006
Event2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States
Duration: Nov 5 2006Nov 10 2006

Publication series

NameAmerican Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES
ISSN (Print)1071-6947

Conference

Conference2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Country/TerritoryUnited States
CityChicago, IL
Period11/5/0611/10/06

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