Realization of deep 3D metal electrodes in diamond radiation detectors

A fabrication technique to create 3D diamond detectors is presented. Deep reactive ion etching was used to create an array of through-diamond vias (TDVs) in a 2 × 2 × 0.15 mm³ electronic grade single crystal diamond detector. The diameter of the TDVs was nominally 30 μm with a pitch of 100 μm between them. The TDVs were filled with chromium using hexavalent chromium electroplating to create 3D electrodes, which were connected electrically by interdigitated electrodes. The fabricated 3D diamond detector responded to both alpha particles and X-rays, exhibiting a charge collection efficiency of 52.3% at 200 V. Comparing to a diamond detector with the same interdigitated electrodes, but no 3D electrodes, confirms that the 3D electrodes are electrically active within the device. The average resistivity of the 3D electrodes is 2.89 ± 0.03 × 10^-5Ω cm, near that of bulk chromium. These results indicate that this fabrication technique is a potential option for 3D diamond detector fabrication.