Abstract
We report on the use of atom probe tomography (APT), scanning transmission electron microscopy (STEM), and secondary ion mass spectroscopy (SIMS) to characterize doping profiles in the base region of SiGe HBT devices. We compare SIMS profiles obtained from large regions (400 um 2 ) of the device wafer to profiles obtained from individual devices of different emitter window widths (0.25 and 0.18 um 2 ) using APT. From this comparison we show how APT can provide a deeper insight into evaluating the fabrication process and its effects on electrical models of device performance and enabling the building of higher performance systems. We also demonstrate that APT can be used to characterize defects within the intrinsic regions of a device.
Original language | English |
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Title of host publication | 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2018 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 255-258 |
Number of pages | 4 |
ISBN (Electronic) | 9781538665022 |
DOIs | |
State | Published - Nov 27 2018 |
Event | 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2018 - San Diego, United States Duration: Oct 15 2018 → Oct 17 2018 |
Publication series
Name | 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2018 |
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Conference
Conference | 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2018 |
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Country/Territory | United States |
City | San Diego |
Period | 10/15/18 → 10/17/18 |
Funding
APT and STEM were conducted at ORNL's CNMS, which is a U.S. D.O.E. Office of Science User Facility.
Keywords
- Atom probe tomography
- HBTs
- Scanning transmission electron microscopy
- Secondary ion mass spectroscopy
- SiGe