Pulse thermal processing for low thermal budget integration of IGZO thin film transistors

Joo Hyon Noh, Pooran C. Joshi, Teja Kuruganti, Philip D. Rack

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

Pulse thermal processing (PTP) has been explored for low thermal budget integration of indium gallium zinc oxide (IGZO) thin film transistors (TFTs). The IGZO TFTs are exposed to a broadband (0.2-1.4 μ m) arc lamp radiation spectrum with 100 pulses of 1 m pulse width. With power density of 3.95 kW/cm2 and 0.1 s total irradiation time, the PTP treated IGZO TFTs showed comparable or improved switching and bias stability properties, at significantly lower thermal budget, to furnace annealed IGZO TFT. The typical field effect mobility μ FE, threshold voltage VT, and sub-threshold gate swing S.S were calculated to be 7.8cm2/V s, 8.1 V, and 0.22 V/decade, respectively. The observed performance shows promise for low thermal budget TFT integration on flexible substrates exploiting the large-area, scalable PTP technology.

Original languageEnglish
Article number6967717
Pages (from-to)297-301
Number of pages5
JournalIEEE Journal of the Electron Devices Society
Volume3
Issue number3
DOIs
StatePublished - May 1 2015

Keywords

  • Thin film transistors
  • pulse thermal annealing
  • thin film

Fingerprint

Dive into the research topics of 'Pulse thermal processing for low thermal budget integration of IGZO thin film transistors'. Together they form a unique fingerprint.

Cite this