TY - JOUR
T1 - Pulse thermal processing for low thermal budget integration of IGZO thin film transistors
AU - Noh, Joo Hyon
AU - Joshi, Pooran C.
AU - Kuruganti, Teja
AU - Rack, Philip D.
N1 - Publisher Copyright:
© 2013 IEEE.
PY - 2015/5/1
Y1 - 2015/5/1
N2 - Pulse thermal processing (PTP) has been explored for low thermal budget integration of indium gallium zinc oxide (IGZO) thin film transistors (TFTs). The IGZO TFTs are exposed to a broadband (0.2-1.4 μ m) arc lamp radiation spectrum with 100 pulses of 1 m pulse width. With power density of 3.95 kW/cm2 and 0.1 s total irradiation time, the PTP treated IGZO TFTs showed comparable or improved switching and bias stability properties, at significantly lower thermal budget, to furnace annealed IGZO TFT. The typical field effect mobility μ FE, threshold voltage VT, and sub-threshold gate swing S.S were calculated to be 7.8cm2/V s, 8.1 V, and 0.22 V/decade, respectively. The observed performance shows promise for low thermal budget TFT integration on flexible substrates exploiting the large-area, scalable PTP technology.
AB - Pulse thermal processing (PTP) has been explored for low thermal budget integration of indium gallium zinc oxide (IGZO) thin film transistors (TFTs). The IGZO TFTs are exposed to a broadband (0.2-1.4 μ m) arc lamp radiation spectrum with 100 pulses of 1 m pulse width. With power density of 3.95 kW/cm2 and 0.1 s total irradiation time, the PTP treated IGZO TFTs showed comparable or improved switching and bias stability properties, at significantly lower thermal budget, to furnace annealed IGZO TFT. The typical field effect mobility μ FE, threshold voltage VT, and sub-threshold gate swing S.S were calculated to be 7.8cm2/V s, 8.1 V, and 0.22 V/decade, respectively. The observed performance shows promise for low thermal budget TFT integration on flexible substrates exploiting the large-area, scalable PTP technology.
KW - Thin film transistors
KW - pulse thermal annealing
KW - thin film
UR - http://www.scopus.com/inward/record.url?scp=84928605139&partnerID=8YFLogxK
U2 - 10.1109/JEDS.2014.2376411
DO - 10.1109/JEDS.2014.2376411
M3 - Article
AN - SCOPUS:84928605139
SN - 2168-6734
VL - 3
SP - 297
EP - 301
JO - IEEE Journal of the Electron Devices Society
JF - IEEE Journal of the Electron Devices Society
IS - 3
M1 - 6967717
ER -