Proton irradiation energy dependence of dc and rf characteristics on InAlN/GaN high electron mobility transistors

  • Chien Fong Lo
  • , Lu Liu
  • , Fan Ren
  • , Stephen J. Pearton
  • , Brent P. Gila
  • , Hong Yeol Kim
  • , Jihyun Kim
  • , Oleg Laboutin
  • , Yu Cao
  • , Jerry W. Johnson
  • , Ivan I. Kravchenko

    Research output: Contribution to journalArticlepeer-review

    13 Scopus citations

    Abstract

    The effects of proton irradiation energy on dc and rf characteristics of InAlN/GaN high electron mobility transistors (HEMTs) were investigated. A fixed proton dose of 5 × 1015 cm-2 with 5, 10, and 15 MeV irradiation energies was used in this study. For the dc characteristics, degradation was observed for sheet resistance, transfer resistance, contact resistivity, saturation drain current, maximum transconductance, reverse-bias gate leakage current, and sub-threshold drain leakage current for all the irradiated HEMTs; however, the degree of the degradation was decreased as the irradiation energy increased. Similar trends were obtained for the rf performance of the devices, with ∼10% degradation of the unity gain cut-off frequency (fT) and maximum oscillation frequency (fmax) for the HEMTs irradiated with 15 MeV protons but 30% for 5 MeV proton irradiation. The carrier removal rate was in the range 0.66-1.24 cm-1 over the range of proton energies investigated.

    Original languageEnglish
    Article number041206
    JournalJournal of Vacuum Science and Technology B: Nanotechnology and Microelectronics
    Volume30
    Issue number4
    DOIs
    StatePublished - Jul 2012

    Funding

    The work performed at UF is supported by an AFOSR MURI monitored by James Huang and by HDTRA (Don Silversmith) under contract U.S. DOD HDTRA Grant No. 1-11-1-0020. A portion of this research was conducted at the Center for Nanophase Materials Sciences, which is sponsored at Oak Ridge National Laboratory by the Office of Basic Energy Sciences, U.S. Department of Energy.

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