Abstract
High-power modules use substrates to house the semiconductor device and for electrical insulation. These substrates are constructed with thermally conductive dielectric material sandwiched between two metals to extract heat from semiconductor chips. Thus, the required cooling performance of a power module is linked to the substrate's thermal performance and can vary based on the substrate technologies. In this study, four substrate technologies were evaluated for space-restricted applications: direct-bonded copper, an insulated metal substrate, a thermally annealed pyrolytic graphite-based insulated metal substrate, and direct-bonded aluminum, where the heat sink is directly attached without thermal interface materials. The finite element results suggest that the popular direct-bonded copper substrate has better thermal performance than the rest of the substrates for space-restricted applications. Furthermore, a modified direct-bonded copper is proposed to further improve thermal performance. The evaluation results show that the modified substrate can handle 30% more losses than its traditional counterpart.
Original language | English |
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Title of host publication | 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 5928-5933 |
Number of pages | 6 |
ISBN (Electronic) | 9798350316445 |
DOIs | |
State | Published - 2023 |
Event | 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023 - Nashville, United States Duration: Oct 29 2023 → Nov 2 2023 |
Publication series
Name | 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023 |
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Conference
Conference | 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023 |
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Country/Territory | United States |
City | Nashville |
Period | 10/29/23 → 11/2/23 |
Funding
VI. ACKNOWLEDGMENT This material is based upon work supported by the US Department of Energy Office of Energy Efficiency and Renewable Energy, Vehicle Technologies Office, under contract number DE-AC05-00OR22725. This manuscript has been authored by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan).
Keywords
- Power electronic substrate
- direct-bonded aluminum
- direct-bonded copper
- insulated metal substrate
- thermally annealed pyrolytic graphite incorporated insulated metal substrate