@article{add23deda521438a956a5fb64e597bb8,
title = "Power cycle testing of power switches: A literature survey",
abstract = "Reliability of power converters and lifetime prediction has been a major topic of research in the last few decades, especially for traction applications. The main failures in high power semiconductors are caused by thermomechanical fatigue. Power cycling and temperature cycling are the two most common thermal acceleration tests used in assessing reliability. The objective of this paper is to study the various power cycling tests found in the literature and to develop generalized steps in planning application specific power cycling tests. A comparison of different tests based on the failures, duration, test circuits, and monitored electrical parameters is presented.",
keywords = "Failure mechanisms, lifetime estimation, physics of failure, power cycling, precursor indicators, semiconductor reliability",
author = "GopiReddy, {Lakshmi Reddy} and Tolbert, {Leon M.} and Burak Ozpineci",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.",
year = "2015",
month = may,
day = "1",
doi = "10.1109/TPEL.2014.2359015",
language = "English",
volume = "30",
pages = "2465--2473",
journal = "IEEE Transactions on Power Electronics",
issn = "0885-8993",
publisher = "Institute of Electrical and Electronics Engineers",
number = "5",
}